Huu Chi, N., Thanh Giang, T., & Van Binh, H. (2000). ENHANCEMENT OF ADHESION OF CU FILM ON THE AL SUBSTRATE BY SPUTTER - ION - PLATING METHOD.(SIP). Science and Technology Development Journal, 3(7&8), 41-47. https://doi.org/https://doi.org/10.32508/stdj.v3i7&8.3579