Huu Chi, N., Thanh Giang, T. and Van Binh, H. (2000) “ENHANCEMENT OF ADHESION OF CU FILM ON THE AL SUBSTRATE BY SPUTTER - ION - PLATING METHOD.(SIP)”, Science and Technology Development Journal, 3(7&8), pp. 41-47. doi: https://doi.org/10.32508/stdj.v3i7&8.3579.