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Abstract
In this paper we describe the effects of the pretreatment of substrate before the deposition and the influences of the deposition conditions on the metal film properties using a magnetron sputtering apparatus. A glow - discharge is essential pretreament in order to improve adhesion of ion - plated Cu film. This is caused by the formation of a mixing zone at the interface between the film and the substrate.
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Article Details
Issue: Vol 3 No 7&8 (2000)
Page No.: 41-47
Published: Aug 31, 2000
Section: Article
DOI: https://doi.org/10.32508/stdj.v3i7&8.3579
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Copyright: The Authors. This is an open access article distributed under the terms of the Creative Commons Attribution License CC-BY 4.0., which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
How to Cite
Huu Chi, N., Thanh Giang, T., & Van Binh, H. (2000). ENHANCEMENT OF ADHESION OF CU FILM ON THE AL SUBSTRATE BY SPUTTER - ION - PLATING METHOD.(SIP). Science and Technology Development Journal, 3(7&8), 41-47. https://doi.org/https://doi.org/10.32508/stdj.v3i7&8.3579
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