ENHANCEMENT OF ADHESION OF CU FILM ON THE AL SUBSTRATE BY SPUTTER - ION - PLATING METHOD.(SIP)
Published:
2000-08-31
Abstract
In this paper we describe the effects of the pretreatment of substrate before the deposition and the influences of the deposition conditions on the metal film properties using a magnetron sputtering apparatus. A glow - discharge is essential pretreament in order to improve adhesion of ion - plated Cu film. This is caused by the formation of a mixing zone at the interface between the film and the substrate.