Article Open Access Logo

ENHANCEMENT OF ADHESION OF CU FILM ON THE AL SUBSTRATE BY SPUTTER - ION - PLATING METHOD.(SIP)

Nguyen Huu Chi 1
Tran Thanh Giang 1
Ho Van Binh 1
Volume & Issue: Vol. 3 No. 7&8 (2000) | Page No.: 41-47 | DOI: 10.32508/stdj.v3i7&8.3579
Published: 2000-08-31

Online metrics


Statistics from the website

  • Abstract Views: 1898
  • Galley Views: 597

Statistics from Dimensions

Copyright The Author(s) 2023. This article is published with open access by Vietnam National University, Ho Chi Minh city, Vietnam. This article is distributed under the terms of the Creative Commons Attribution License (CC-BY 4.0) which permits any use, distribution, and reproduction in any medium, provided the original author(s) and the source are credited. 

Abstract

In this paper we describe the effects of the pretreatment of substrate before the deposition and the influences of the deposition conditions on the metal film properties using a magnetron sputtering apparatus. A glow - discharge is essential pretreament in order to improve adhesion of ion - plated Cu film. This is caused by the formation of a mixing zone at the interface between the film and the substrate.

Comments